Applied Materials has introduced the new the Applied Endura® Amber™ physical vapor deposition system. It was designed to deposit copper interconnects with dimensions of around 22 nm (200 atoms across). The system deposits a thin layer of copper and then warms it to allow capillary forces to pull the copper into the copper connection trenches. Electrochemical plating then follows to fill in this seed layer. A short video on Applied Materials Blog gives an overview of the new system.